Model Number: {{currentSku}}
Industrial NVMe SSD
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Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See moreBuilt on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
... See more
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Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Enabling next generation of data-intensive industrial applications and autonomous driving designs
Built on the robust 96 layer 3D NAND architecture and leveraging the NVMe architecture, the IX SN530 introduces high performance and endurance to support break through innovation development in industrial and autonomous driving applications.
The IX SN530 features a PCIe Gen3x4 NVMe™1 interface with industrial grade NAND to provide extended operating temperature ranges and endurance. Designed to provide versatility and value across multiple capacities, M.2 2230 and 2280 form factors and the choice of SLC or TLC configurations to bring the latest in robust and long-life design to the industrial space.
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Operating Temperatures
Today’s technology must be able to operate within a wide range of temperatures. The latest in industrial technologies it is designed for the elements ranging from summer heatwaves to winter snowstorms and the data gathered by these systems is expected to survive these harsh conditions. The new IX SN530 NVMe SSD wide operating temperature support (-40˚C to +85˚C) allows designers to worry less about the need to keep the storage device cool or warm so that they can design their latest innovations with the utmost confidence and flexibility.
Built for Rugged and Extreme Conditions
The IX SN530 is designed to not only operate in a wider range of temperatures, but also to withstand more extreme conditions by having shock resistance of 1,500G at 0.5msec and vibration resistance of forces of 20G at 7Hz to 2,000Hz. Combined with projected endurance of up to 24,000 TBW for supporting write intensive applications, the IX SN530 is ideal for systems placed in remote, hard to access locations, where conditions can change without warning.
Endurance
For write intensive applications, such as data recorder, “black box” and data logging, the IX SN530 SLC option, with endurance of up to up to 24,000 TBW (projected) and sustained sequential write performance of up to 1,950 MB/s, saves the need to use multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to 5 times the TLC sustained write performance.
In-house Robust Design
The IX SN530 is a Western Digital fully vertically integrated storage solution. From the 96 Layer 3D NAND, in house controller and firmware, to internal validation and qualification. Enabling the high quality and reliability expected of an Industrial grade SSD.
Performance to Match Rugged Demands
Using PCIe Gen 3x4, the IX SN530 delivers incredible speeds to meet the growing performance requirements of Industrial IoT systems. With sequential read speeds of up to 2,400 MB/s and write speeds of up to 1,950 MB/s, the IX SN530 matches its toughness with speed.
NVMe SSDs Provide Options
With two form factors, M.2 2280 and M.2 2230, the IX SN530 provides flexibility for the design and mechanical constraints system designers may encounter when considering high capacity storage solutions.
Highlights
● -40˚C to +85˚C Operating Temperature
● 20G @ 7-2000Hz Operating Vibrational Frequency
● 256GB to 2TB Capacities (2TB only available in M.2 2280 Form Factor)2
● Endurance projected up to 5,200 TBW (TLC) and up to 24,000 TBW (SLC)3
● Sequential Read speeds up to 2,400MB/s and Write speeds up to 1,950MB/s4
● TLC and SLC configurations available
● M.2 2230 and M.2 2280 Form Factors
Applications and Workloads
● Robotics
● Industrial PCs
● Factory Automation
● Digital Signage
● Fanless designs
● Networking equipment
● In-flight entertainment systems
● IoT Edge Gateways
● Data logging for autonomous driving system
● Boot device for automobile systems
● Data recording and mobile DVRs for public transportation
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Specifications
- Endurance of up to 5200 TBW (TLC) and up to 24000 TBW (SLC)
- Supports a wide range of environmental conditions, including operating temperatures, shock, and vibration
- Ideal for industrial PCs, factory automation, robotics, fanless designs, and more
Ratings & Reviews
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Disclosures
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).
- PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width: x1, x2 and x4. NVM Express version 1.4.
- The capacities are based on IDEMA HDD Specification. See www.idema.org for details. 1 gigabyte (GB) = 1 billion bytes ; 1 terabyte (TB) = 1 trillion bytes ; 2TB is supported by M.2 2280 form factor only.
- TBW = Terabytes Written. Endurance is calculated based on sustained sequential write operation without frequent idle.
- Test Conditions: Performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained specifications.
- Based on WD’s internal calculation, using a prediction methodology in accordance with the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
- Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal throttling will be initiated.
- The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB <=1.5mm (S3).